Electronic Part Containing a Metal Component Sourced from a Conflict-Free Mine Site and a Method of Forming Thereof

ABSTRACT

A method of forming an electronic part comprising a metal component is provided. The method includes obtaining an unverified mineral sample from a mine site, analyzing the unverified mineral sample via quantitative mineralogical analysis and comparing data collected during the quantitative mineralogical analysis for the sample to data in a database that corresponds to quantitative mineralogical analysis collected for verified mineral samples sourced from one or more mine sites from the conflict-free geographic region to determine if the unverified mineral sample is sourced from one or more mine sites from the conflict-free geographic region. If it is determined that the unverified mineral sample is sourced from one or more mine sites from the conflict-free geographic region, the method then involves converting the unverified sample into the metal component. The electronic part can be a capacitor, medical device, filter, inductor, active electrode, antenna, sensor, or battery.

CROSS REFERENCE TO RELATED APPLICATIONS

The present application claims the benefit of U.S. ProvisionalApplication Ser. No. 62/561,245 having a filing date of Sep. 21, 2017,which is incorporated herein by reference for all purposes.

BACKGROUND OF THE INVENTION

Conflict resources are natural resources (i.e., resources that existwithout the actions of humankind) that are found in geographic regionstermed “conflict zones” and are often sold to finance armed conflict andcivil wars. An example of a conflict resource is a conflict mineral.Conflict minerals can include metals such as gold, tin, and tungsten.Other metals that may be mined in conflict regions and thatmanufacturers may want to monitor for their geographic origin includecobalt and copper. One particular region in which conflict minerals havebeen mined and sold in order to perpetuate conflict is the DemocraticRepublic of Congo (DRC).

The Dodd-Frank Wall Street Reform and Consumer Protection Act was signedinto law in the United States in 2010 and requires U.S. and certainforeign companies to report and make public their use of conflictminerals from the DRC and its surrounding countries (e.g., Angola,Burundi, Central African Republic, Congo Republic, Rwanda, Sudan,Tanzania, Uganda, and Zambia) in their products. A similar law has beenpassed in Europe, but it extends to all countries rather than just theDRC and adjoining countries. The U.S. Conflicts Minerals Law requiresindependent third party supply chain traceability audits and reportingof audit results to the public and the Securities and ExchangeCommission. In order to comply with the auditing and reportingrequirements and ensure that companies are not using conflict mineralsin their products, an accurate, reliable method for identifying thegeographic origin of a mineral (e.g., the mine site or mine sites fromwhich it is sourced) to ensure that it is a conflict-free mineral wouldbe useful as first step in the processes involved in making variousproducts that include materials prevalent in geographic regions ofconflict or in verifying the origin of a particular mineral in general,whether it be from a geographic region of conflict or not.

Because many electronic parts such as capacitors (e.g., solidelectrolytic, wet electrolytic, and ceramic capacitors), medicaldevices, filters, inductors, active electrodes, antennas, sensors,lithium batteries, rechargeable batteries, etc., include metalcomponents such as feedthroughs, plating, conductive adhesives orpastes, lead frames, terminations, pins, wires, brazing, coils, etc.,where there is a risk that such metals have been sourced from geographicregions where conflict is present, a need exists for an electronic partand a method of making thereof, where the manufacturer can be assuredthat one or more of the metal components contained in the electronicpart is sourced from conflict-free mine site.

SUMMARY OF THE INVENTION

In accordance with one embodiment of the present invention, a method offorming an electronic part containing a metal component is disclosedthat includes obtaining an unverified mineral sample from a mine siteand analyzing the unverified mineral sample via quantitativemineralogical analysis and comparing data collected during thequantitative mineralogical analysis for the unverified mineral sample todata in a database that corresponds to quantitative mineralogicalanalysis collected for verified mineral samples sourced from one or moremines sites from a conflict-free geographic region to determine if theunverified mineral sample is sourced from one or more of the mine sitesfrom the conflict-free geographic region. Further, if it is determinedthat the unverified mineral sample is sourced from the one or more ofthe mines sites from the conflict-free geographic region, the unverifiedmineral sample is then converted into the metal component.

In accordance with another embodiment of the present invention, anelectronic part containing a metal component is disclosed, where metalcomponent includes a metal, where it is verified that the metal issourced from one or more mine sites from a conflict-free geographicregion by analyzing an unverified mineral sample from which the metal isobtained via quantitative mineralogical analysis and comparing datacollected during the quantitative mineralogical analysis for theunverified mineral sample to data in a database that corresponds toquantitative mineralogical analysis collected for verified mineralsamples sourced from the one or more mine sites from the conflict-freegeographic region to determine that the unverified mineral sample issourced from the one or more of the mines sites from the conflict-freegeographic region.

Other features and aspects of the present invention are described inmore detail below.

BRIEF DESCRIPTION OF THE DRAWINGS

A full and enabling disclosure of the present invention, including thebest mode thereof to one skilled in the art, is set forth moreparticularly in the remainder of the specification, including referenceto the accompanying figures, in which:

FIG. 1 is a block diagram illustrating a method for determining thegeographic origin of a mineral sample;

FIG. 2 is a block diagram of a system used in determining the geographicorigin of a mineral sample;

FIG. 3 is a schematic illustration of one embodiment of a solidelectrolytic capacitor that may be formed in accordance with the presentinvention; and

FIG. 4 is an exploded schematic illustration of a wet electrolyticcapacitor that may be formed in accordance with the present invention;and

FIG. 5 is a schematic illustration of one embodiment of a ceramiccapacitor that may be formed in accordance with the present invention;

Repeat use of reference characters in the present specification anddrawings is intended to represent the same or analogous features orelements of the present invention.

DETAILED DESCRIPTION OF REPRESENTATIVE EMBODIMENTS

It is to be understood by one of ordinary skill in the art that thepresent discussion is a description of exemplary embodiments only, andis not intended as limiting the broader aspects of the presentinvention.

Generally speaking, the present invention is directed to an electronicpart such as a capacitor (e.g., a solid electrolytic capacitor or a wetelectrolytic capacitor), medical device, filter, inductor, activeelectrode, antenna, sensor, etc. that includes a metal component (e.g.,a feedthrough, plating, conductive paste or adhesive, lead frame,termination, pin, wire, brazing, coil, etc.), where the metal componentcontains a metal sourced from a conflict-free mine site, as well as amethod of forming thereof. The method includes obtaining an unverifiedmineral sample (e.g., an ore concentrate that has not yet been smeltedto a pure metal) from a mine site and analyzing the unverified mineralsample via quantitative mineralogical analysis and comparing datacollected during the quantitative mineralogical analysis for theunverified mineral sample to data in a database that corresponds toquantitative mineralogical analysis collected for verified mineralsamples sourced from one or more mine sites from a conflict-freegeographic region to determine if the unverified mineral sample issourced from the one or more mines sites from the conflict-freegeographic region. Analyzing the unverified mineral sample can includeperforming automated mineralogy testing on the sample, identifyinggrains for further testing, and performing electron microprobe analysisand laser ablation inductively coupled plasma spectrometry on theidentified grains. If it is determined that the unverified mineralsample is sourced from one or more of the mine sites from theconflict-free geographic region, the method then involves converting themetal obtained from the unverified mineral sample into the metalcomponent of the electronic part, where the metal can include gold,cobalt, copper, tin, tungsten, lithium, or a combination thereof.

It should be understood that the mineral determination methods describedherein are based on the fact that geological units, geographic regions,and even specific mine sites within a geographic region aredistinguished from each other due to their distinct geologicalcharacteristics. For example, the regional and local variations in thecomposition of tantalum minerals reflect the conditions of formation,the geological environment (e.g., host rocks), and the age of theemplacement of the host pegmatite. These factors influence the presencespecific minerals, as well as their basic and detailed characteristics,the enrichment of major and minor elements, and the presence or absenceof other mineralogical and geochemical features.

Specifically, prior to using metal obtained from a mineral sample toform a component of an electronic part, the present inventors havedeveloped a methodology for determining whether or not the allegedconflict-free metal (for instance, a metal that has been independentlyvalidated and alleged to by conflict-free via a mineral determinationmethod) received from a supplier is in fact sourced from a conflict-freemine site. It is also to be understood that this methodology can be usedto compare samples for risk mitigation purposes in order to determine ifa sample received from a supplier is sourced from a mine site located ina geographic region that has been approved by the electronic partsmanufacturer, where such information can be used for investigativepurposes if an outlier sample (a sample that cannot be matched with anyof the approved or verified samples in the database) is received. Ageneral description of the method is shown in FIG. 1.

Turning to FIG. 1, the method 100 of forming a metal component of anelectronic part from a conflict-free metal includes first obtaining anunverified sample (i.e., a sample that has not been verified asconflict-free) from a mine site, where the sample may have beenindependently validated or described as conflict-free by another party(step 101). The sample is self-collected as a heavy-mineral pannedconcentrate directly at the mine site to be sure about the origin of thesample and to collect the sample before any further processing iscarried out to preserve the complete heavy mineral association. Next, instep 102, a section of the sample is formed to a polished epoxy sectionhaving a diameter of about 25 millimeters (mm), which is then coatedwith a carbon layer having a thickness of about 10 nanometers (nm) toprepare the sample for testing.

Then, in step 103, the polished section is scanned via automatedmineralogy (AM) to determine the specific minerals present in the sampleas well as the prevalence and distribution of each of the minerals inthe polished section, where samples taken from the same mine site anddepth should include the same minerals and at substantially the sameprevalence and distribution. If samples from the same mine site anddepth do not include substantially the same minerals with substantiallythe same prevalence and distribution, then it is possible that thesupplier added extraneous material to the sample before shipment.Thereafter, in step 104, grains from the polished section of the sampleare selected for further analysis. For example, 50 grains containingtantalum, as determined from the AM scan, are selected for furtheranalysis.

Next, in step 105, electron micro probe analysis (EMPA) is carried outon the selected grains. The raw EMPA data provides for the major andminor (trace) elements of the 50 grains based on weight percentage.

For gold (Au), the major element is gold (Au), while the minor/traceelements can include silver (Ag), copper (Cu), mercury (Hg), tellurium(Te), antimony (Sb), selenium (Se), sulfur (S), ruthenium (Ru), rhodium(Rh), palladium (Pd), osmium (Os), iridium (Ir), platinum (Pt), lead(Pb), samarium (Sm), barium (Ba), tin (Sn), molybdenum (Mo), zirconium(Zr), germanium (Ge), iron (Fe), and manganese (Mn).

For cobalt (Co), the major elements can include cobalt (Co), copper(Cu), nickel (Ni), arsenic (As), sulfur (S), and iron (Fe), while theminor/trace elements can include zinc (Zn), antimony (Sb), lead (Pb),selenium (Se), tungsten (W), tellurium (Te), manganese (Mn), platinum(Pt), bismuth (Bi), magnesium (Mg), and uranium (U).

For copper (Cu), the major elements can include copper (Cu), iron (Fe),sulfur (S), zinc (Zn), and antimony (Sb), while the minor/trace elementscan include nickel (Ni), cobalt (Co), chromium (Cr), Mo (molybdenum),lead (Pb), tin (Sn), mercury (Hg), gold (Au), silver (Ag), arsenic (As),cadmium (Cd), iridium (Ir), indium (In), selenium (Se), tellurium (Te),rhenium (Re), osmium (Os), palladium (Pd), platinum (Pt), ruthenium(Ru), rhodium (Rh), thallium (TI), bismuth (Bi), barium (Ba), hafnium(Hf), rubidium (Rb), scandium (Sc), tantalum (Ta), thorium (Th), uranium(U), zirconium (Zr), and the rare earth elements (REE) (e.g., lanthanum(La), cerium (Ce), praseodymium (Pr), neodymium (Nd), samarium (Sm),europium (Eu), gadolinium (Gd), terbium (Tb), dysprosium (Dy), yttrium(Y), holmium (Ho), erbium (Er), thulium (Tm), ytterbium (Yb), lutetium(Lu)).

For tin (Sn), the major elements can include tin (Sn), iron (Fe), copper(Cu), lead (Pb), niobium (Nb), tantalum (Ta), titanium (Ti), tungsten(W), and manganese (Mn), while the minor/trace elements can includezirconium (Zr), hafnium (Hf), zinc (Zn), scandium (Sc), gallium (Ga),vanadium (V), uranium (U), chromium (Cr), antimony (Sb), strontium (Sr),arsenic (As), indium (In), bismuth (Bi), magnesium (Mg), aluminum (Al),silicon (Si), and calcium (Ca).

For tungsten (W), the major elements can include tungsten (W), iron (Fe)manganese (Mn), and calcium (Ca), while the minor/trace elements caninclude magnesium (Mg), hafnium (Hf), indium (In), tin (Sn), niobium(Nb), zinc (Zn), titanium (Ti), scandium (Sc), zirconium (Zr), tantalum(Ta), lead (Pb), molybdenum (Mo), cobalt (Co), vanadium (V), uranium(U), arsenic (As), aluminum (Al), barium (Ba), strontium (Sr), gallium(Ga), bismuth (Bi), antimony (Sb), silicon (Si), and the rare earthelements (REE) (e.g., lanthanum (La), cerium (Ce), praseodymium (Pr),neodymium (Nd), samarium (Sm), europium (Eu), gadolinium (Gd), terbium(Tb), dysprosium (Dy), yttrium (Y), holmium (Ho), erbium (Er), thulium(Tm), ytterbium (Yb), and lutetium (Lu)).

For lithium (Li), the major elements can include lithium (Li), silicon(Si), aluminium (Al), potassium (K), phosphorus (P), and fluorine (F),while the minor/trace elements can include sodium (Na), iron (Fe),manganese (Mn), magnesium (Mg), calcium (Ca), rubidium (Rb), cesium(Cs), strontium (Sr), barium (Ba), titanium (Ti), and zinc (Zn).

Further, in step 106, laser ablation inductively coupled plasmaspectrometry (LA-ICP-MS) is performed on selected grains to determinethe trace/minor elements and rare earth elements present in the grainsin parts per million (ppm).

In step 107, data from steps 103, 104, and 106 is then compiled todetermine if the characteristics of the unverified sample from theallegedly conflict-free mine site substantially match thecharacteristics of verified samples from one or more conflict-free minesites. If so, it can be assumed that the unverified sample in factoriginated and was sourced from a validated conflict-free mine site sothat the now verified sample can be used to form a metal component ofany of the electronic parts contemplated by the present invention.

Details regarding the various steps are described in more detail below.

I. Determining if a Mineral Sample Containing a Metal Originates From aConflict-Free Mine Site A. Sample Receipt (101) and Preparation (102)

First, a mineral sample is obtained from a mine site, where the mineralsample is a mineral pre-concentrate (raw ore) or concentrate (raw orethat is finely ground and from which waste has been removed). Themineral sample can weigh between about 25 grams and about 125 grams,such as from about 50 grams to about 100 grams, in order to obtain arepresentative sample of the mineral. The mineral sample is then reducedto a smaller sample that can weigh between about 2.5 grams and about12.5 grams, such as between about 5 grams and about 10 grams. The grainsin the smaller sample are then formed into a polished epoxy section on asample mount having a diameter of about 25 millimeters (mm) so that thegrain interiors are exposed for subsequent analysis, after which thepolished epoxy section is coated with a carbon layer having a thicknessof about 10 nanometers (nm).

B. Automated Mineralogy Analysis Using Scanning Electron Microscopy andWavelength-Dispersive X-Ray Spectroscopy or Energy DispersiveSpectroscopy (103)

Next, after a sample has been mounted and polished as discussed above,the sample is analyzed quantitatively via automated mineralogy (AM) todetermine its mineralogical composition via quantitative analysis. Themounted sample is analyzed using a scanning electron microscopy(SEM)-based mineral analyzer combined with a wavelength-dispersive X-ray(WDS) spectrometer or an energy dispersive spectrometer (EDS). Such adevice provides information on the proportions of minerals in thepolished section, which are then chemically characterized using WDS orEDS without a need to move the sample or perform a new search forspecific particles. The result is (1) an AM image that distinguished thevarious minerals in the sample by color/shading and (2) information onthe proportional presence of the various minerals in a pie chart or barchart. The AM image provides valuable textural and mineralogicalinformation (e.g., liberation degree, mineral association, grain size,intergrowths of minerals, inclusions, etc.).

An example of a machine that performs such automated mineralogy (AM)analysis is a Tescan Integrated Mineral Analyzer (TIMA) available fromTESCAN ORSAY HOLDING (Czech Republic). The TIMA a fully automated, highthroughput, analytical scanning electron microscope designedspecifically for the mining and minerals processing industry. The TIMAis useful for mineral liberation analysis, process optimization,remediation, and search for precious metals and rare earths. TIMAmeasures modal abundance, size-by-size liberation, mineral association,etc. and performs a PGM search automatically on multiple samples ofgrain mounts and thin or polished sections. The technology is based on acompletely integrated EDX system that performs full spectrum imaging atvery fast scan speeds. Image analysis in TIMA is performedsimultaneously with SEM backscattered electron images and a suite ofX-ray images. The level of hardware integration of the SEM and EDXallows for fully automated data collection.

Using the software, the polished surface of the mounted sample isscanned by an electron beam and the resulting back-scatter electrons arecollected to generate electronic image information. All mineral grainsexposed on the sample surface are then automatically analyzed usingenergy-dispersive X-ray spectrometry, where a characteristic X-rayspectrum is produced for each particle. This information is thencompared to a calibrated standard mineral reference database. Theautomated mineralogy (AM) software is able to automatically identifyindividual minerals at a spatial resolution of 0.005 millimeters andthen quantifies the percent abundance of each mineral present in themounted sample, noting that the percent abundance of a specific mineralin sample depends on numerous variables such as the specific individualwho prepared the panned sample, whether the sample was magnetically orgravity separated, etc.

As a result of AM and as mentioned above, the minerals present in thesample can be determined by viewing a color-coded or shaded scan of thepolished section, and then individual grains can be selected for furtherdetailed study and analysis in steps C and D below. In addition, AMprovides information regarding grain size, liberation degree, mineralassociation, intergrowths of specific minerals, inclusions, etc., whichmay be unique depending on the geographic region from which the samplewas obtained. Further, possible mixing in of a material from a differentmine (e.g., adding in aluminum into a tin sample) can be revealed viaAM. In addition, it is noted that the proportion of minerals may changeslightly over time between samples taken from the same mine site due tochanging geology during mining, different degrees of ore processing,etc. However, if the proportion of minerals changes significantly, thenthe supplier or third party must give an explanation.

Various types of information can be gathered during AM analysis of amineral sample. Specifically, an automated mineralogy scan (using TIMA)can be obtained for a polished microlite sample where various mineralsin the sample are shaded by species. In addition, a pie diagram showingthe various minerals present in the automated mineralogy scan in termsof weight % can be produced, where a corresponding chart can show thespecific weight % for each of the minerals present in the scan.

C. Electron Micro Probe Analysis (104 and 105)

Next, between about 25 grains and 125 grains, such as about 50 grains toabout 100 grains, such as 50 grains, selected from the AM scan of themounted sample are analyzed using electron micro probe analysis (EMPA),which utilizes a combination of an electron microscope and an X-rayspectrometer, where X-rays are detected based on energy (EDS) and/orwavelength (WDS). The grains are randomly selected from the grainspresent for the specific mineral of interest, but it is to be understoodthat grains that have been altered or cracked are excluded from EMPAanalysis. EMPA, also called electron probe microanalysis (EPMA), is ananalytical technique that is used to establish the composition of smallareas of samples via quantitative analysis. An example of a machine thatcan perform such analysis is the CAMECA SX100 Electron Microprobe,available from CAMECA (France). The microprobe can be operated at a 15kiloVolt acceleration voltage and a 20 nanoAmp sample current with abeam size of 5 micrometers.

EMPA is a particle-beam technique where a beam of accelerated electronsis focused on the surface of a specimen using a series ofelectromagnetic lenses, and these energetic electrons producecharacteristic X-rays within a small volume (typically 1 to 9 cubicmicrons) of the sample at its surface. The characteristic X-rays aredetected at particular wavelengths, and their intensities are measuredto determine concentrations of elements within the sample. All elementsexcept hydrogen (H), helium (He), and lithium (Li) can be detectedbecause each element has a specific set of X-rays that it emits. EMPAhas a high spatial resolution and sensitivity, and individual analysesare reasonably short, requiring only a minute or two in most cases.Additionally, the electron microprobe can function like a scanningelectron microscope (SEM) and obtain highly magnified secondary andbackscattered electron images of a sample. From EMPA, the weightpercentage of the major elements and trace/minor elements or theiroxides as well as evolutionary trends of the sample can be determined.

Mineralogical features of the sample, such as zonality, can also bedetermined via EMPA. The zonality of the grains can be indicative of thegeographic origin of the mineral. For instance, regular or irregularzones, zones rich in one metal and low in another metal, or zones thatare e.g. sectorially zoned vs. homogeneous may indicate that the samplehas a specific geographic origin. The degree of alteration of thegrains, the presence of inclusions of different minerals, and thepresence of intergrowths with other minerals can also be indicative ofthe geographic origin of the sample.

Further, EMPA can serve as a standardization tool for laser ablationinductively coupled plasma mass spectrometry, which is discussed in moredetail below in Step D. Specifically, the major elements obtained viaEMPA (e.g., gold, cobalt, copper, tin, tungsten, etc.) are used asinternal reference elements in laser ablation inductively coupled plasmamass spectrometry in order to standardize or normalize the data for thetrace/minor elements (discussed above) that may be present in eachsample. Further, is to be understood that laser ablation inductivelycoupled plasma mass spectrometry (LA-ICP-MS) or secondary ion massspectrometer (SIMS) can be used to detect lithium (Li) andmulti-collector inductively coupled mass spectrometry (MC-ICP-MS) orthermal ionization mass spectrometry (TIMS) to detect Li isotopes ratiocan alternatively be used instead of EMPA.

D. Laser Ablation Inductively Coupled Plasma Mass Spectrometry (106)

After EMPA or an alternative detection method such as for the detectionof lithium described above, the same grains selected above in Step C areanalyzed by laser ablation inductively coupled mass spectrometry(LA-ICP-MS) to quantitatively determine the trace/minor elements and REEpresent in the sample in ppm. LA-ICP-MS enables highly sensitiveelemental and isotopic analysis to be performed directly on solidsamples. LA-ICP-MS begins with a laser beam focused on the samplesurface to generate fine particles—a process known as laser ablation.The ablated particles are then transported to the secondary excitationsource of the ICP-MS instrument for digestion and ionization of thesampled mass. The excited ions in the plasma torch are subsequentlytransferred to a mass spectrometer detector for both elemental andisotopic analysis. An example of a machine that can perform suchanalysis is the Agilent 7500CE ICP-MS, available from AgilentTechnologies (Santa Clara, Calif.), as well as the laser ablation systemUP 213.

The results of LA-ICP-MS are the concentration of numerous elements,such as from about 5 elements to about 50 elements, such as from about10 elements to about 40 elements, in parts per million (ppm). Theconcentration of selected minor/trace elements are then used for furtherevaluation. This data is then normalized, where these normalized dataare then plotted to diagrams and compared to a database of diagrams forREE and trace/minor elements for verified conflict-free samples fromvarious mine sites.

If a diagram from a sample substantially matches a diagram for a samplethat has already been tested and stored in the database, then it can bedetermined that the geographic origin (mine site) of the sample is sameas the geographic origin (mine site) of the database sample. It shouldbe understood that different minerals have different shapes to the REEand trace/minor element curves due to the different rules of elementincorporation to the structure, but the proportional enrichment of theelements characteristic for a specific mine site should be generallyretained. While major and minor element composition can be highlyvariable, the enrichment of the ore in a specific REE pattern can begenerally the same for samples from the same locality or mine site.Further, good correlation between trace elements can be present on adeposit or district scale.

The variations in the amount of REE present in parts per million (ppm)depending on the mine site that can be detected via LA-ICP-MS means thatLA-ICP-MS analysis can be used as a tool to determine the particularmine site from which a sample is obtained, where it can be furtherdetermined if the sample is in fact from a conflict-free mine site andgeographic region. In other words, LA-ICP-MS in conjunction with theother steps discussed above can be used to verify that mineralsdelivered from specific mine sites that have been independentlyvalidated as conflict-free do in fact originate from the specific minesite as claimed, at least for metals that bear REE.

Further, it is to be understood that in some instances, such as when themetal of interest is lithium, the ore minerals may not include usableamounts of trace elements for LA-ICP-MS, so e.g. isotope ratios may needto be utilized instead, such as ⁶Li/⁷Li ratio.

E. Geochronology Analysis

Although not shown in FIG. 1, geochronology analysis can also beconducted to distinguish the geographic origin of a tin (Sn) ore (i.e.,cassiterite), tungsten (W) ore (i.e., wolframite), and lithium (Li) ore(i.e., lepidolite) based on the age of the ore concentrate using theUranium-Lead (U—Pb) dating method, as tin and tungsten ores may containhigh levels of uranium and low levels of lead and are thus suitable forU—Pb radiometric dating. In situ analysis by LA-ICP-MS can be used toacquire the age of the minerals in a sample of mixed concentrates, andthe age can be used for comparison to ages stored for various samples ina database obtained from validated conflict-free mine sites, where asample having a similar age to a sample from a validated conflict-freemine site may be from the validated conflict-free mine site.

Uranium-lead (U—Pb) dating is one of the oldest and most refined of theradiometric dating schemes. It can be used to date rocks that formedfrom about 1 million years to over 4.5 billion years ago with routineprecisions in the 0.1% to 1% range. The uranium-lead dating methodrelies on two separate decay chains, the uranium series from ²³⁸U to²⁰⁶Pb, with a half-life of 4.47 billion years and the actinium seriesfrom ²³⁵U to ²⁰⁷Pb, with a half-life of 710 million years. These uraniumto lead decay routes occur via a series of alpha (and beta) decays, inwhich ²³⁸U with daughter nuclides undergo eight total alpha and six betadecays whereas ²³⁵U with daughters only experience seven alpha and fourbeta decays. The existence of two parallel uranium-lead decay routes(²³⁸U to ²⁰⁶Pb and ²³⁵U to ²⁰⁷Pb) leads to multiple dating techniqueswithin the overall U—Pb system. The term U—Pb dating normally describedherein refers to the coupled use of both decay schemes.

F. Analysis to Determine If Sample Is From a Conflict-Free Mine Site(107)

After the steps described above are completed, the data from each of thesteps for a particular unverified mineral sample is compared to datastored in a database, where the data stored in the database correspondswith the same test results for mineral samples from mine sites that havebeen previously verified as conflict-free. The data is in the form ofraw data, calculated or normalized data, tables, charts, and diagramsfor individual samples or comparisons of samples, AM images, calculatedages, and mineralogical study documents. Various statistical methods canthen be applied to the data for data processing such as univariateanalysis and multivariate analysis. Univariate analysis can be appliedfor the characterization and description of element distribution withina sample (e.g., distribution shape, multimodality, etc.), and brothersamples can be identified using Wilcoxon and Kolmogorov-Smirnov tests.Meanwhile, multivariate analysis can be applied to determinedependencies between elements in a sample (e.g., correlation, graphicalmethods), unsupervised classification methods (e.g., hierarchical andfuzzy cluster analysis, principal component analysis, Kohonen maps(SOM), classification and regression trees (CART), and artificial neuralnetworks (ANN)).

The final results of the statistical evaluation comparing an unverifiedsample to the database of verified conflict-free samples is the finalnumber in percent (%) that corresponds to the conformity of theunverified sample and a verified conflict-free sample from the database.The higher the percentage match (probability match) or correlation, thenthe more likely it is that the unverified sample is from the same,conflict-free mine site as the verified sample. For instance, a percentmatch between an unverified sample and a verified sample of at least50%, such as from about 60% to 100%, such as from about 65% to about100%, such as from about 70% to about 100%, indicates that theunverified sample and the verified sample originate from the sameconflict-free mine site or mine sites from the same geographic region.The ability to make such a determination demonstrates that the mineralsource identification tools and methods of the present application canbe used to identify the particular mine site or multiple mine sites fromwhich a mineral sample is received and to mitigate risk of sourcingminerals (e.g., gold, cobalt, copper, tin, tungsten, lithium, etc.) fromunapproved mine sites or mine sites in conflict areas.

For example, Table 1 is chart comparing the correlation or similaritybetween various metal samples to determine the probability that anunknown sample was sourced from one of four verified/known mine sites.Specifically, twenty two samples received were processed to determinethe elemental distribution within the grains in each sample, theelemental analysis information was determined, and the percentcorrelation or similarity to various samples from verified/known minesites was determined using the Kolmogorov-Smirnov test. A % correlationof less than 50% indicates that an unknown sample is not sourced from aknown mine site, a % correlation between 50-60% indicates that there isa possibility that an unknown sample is sourced from a known mine site(although additional verification should be completed), and a %correlation greater than 60% indicates that an unknown sample is sourcedfrom a known mine site.

Referring to Table 1 below, it can be determined that unknown samples 2,4, 8, 12-18, and 21-22 are sourced from mine site 1, unknown samples5-7, 10, and 20 are sourced from mine site 2, and unknown sample 1 issourced from mine site 3.

TABLE 1 Probablity (%) That Unknown Sample Sourced from Verified MineSite Based on Element Distribution in Analyzed Grains Using theKolmogorov- Smirnov Test Probability (%) That Unknown Sample Sourcedfrom Verified Mine Site Based on Element Distribution in AnalyzedGrains - Kolmogorov-Smirnov Test Verified Sample 1 Verified Sample 2Verified Sample Verified Sample Verified Sample Sample Name Mine 1 Mine1 Mine 2 Mine 3 Mine 4 Unknown Sample 1 43 37 23 58 1 Unknown Sample 272 70 30 40 3 Unknown Sample 3 28 23 9 30 0 Unknown Sample 4 80 76 29 423 Unknown Sample 5 17 21 69 18 34 Unknown Sample 6 21 24 71 22 32Unknown Sample 7 14 17 67 16 35 Unknown Sample 8 63 50 21 43 2 UnknownSample 9 40 43 44 33 21 Unknown Sample 10 13 14 60 15 34 Unknown Sample11 15 18 59 14 46 Unknown Sample 12 69 56 22 45 1 Unknown Sample 13 6454 23 45 3 Unknown Sample 14 61 50 17 41 1 Unknown Sample 15 61 51 22 412 Unknown Sample 16 62 49 19 47 1 Unknown Sample 17 61 49 21 42 2Unknown Sample 18 65 52 25 47 5 Unknown Sample 19 50 44 25 44 4 UnknownSample 20 18 23 66 20 27 Unknown Sample 21 66 59 24 44 2 Unknown Sample22 63 55 35 48 13

If it cannot be verified that the unverified sample is from the minesite (e.g., a conflict-free mine site or approved mine site) from whichit is claimed to originate, the sample is returned and not used in theproduction of the electronic parts contemplated by the presentinvention, as described in step 108. Meanwhile, if it can be verifiedthat the unverified sample is from the conflict-free mine site fromwhich it is claimed to originate, the sample can be used to make a metalcomponent of an electronic part as contemplated by the present inventionand as described in step 109.

The analysis steps described in FIG. 1 and set forth above can becarried out using the apparatus 200 shown in FIG. 2. The apparatus 200includes a computer system 202. The computer system 202 may include oneor more processors 220 that are in communication with one or more memorydevices 222. The computer system 202 may include a local communicationinterface 226 for the components in the computer system 202. Forexample, the local communication interface 226 may be a local data busor any related address or control busses.

The memory device 222 may contain modules that are executable by theprocessor(s) 220 and data for the modules. Located in the memory device222 are data stored in the database 204 from previous analyses relatedto samples from mine sites that have been validated or verified asconflict-free. Sample data 224 is also located in the memory device 222for storing data related to the unverified samples currently beingtested. Although not shown, the memory device 222 can also store datedrelated to other applications along with an operating system that isexecutable by the processor(s).

Other applications may also be stored in the memory device 222 and maybe executable by the processor(s) 220. Components discussed in thisdescription may be implemented in the form of software using highprogramming level languages that are compiled, interpreted or executedusing a hybrid of the methods.

The computer system 202 may also have access to I/O (input/output)devices that are usable by the computing devices. An example of an I/Odevice is a display screen 218 that is available to display output fromthe computer system 202. Other known I/O devices may be used with thecomputer system 202 as desired. One or more networking devices 206 andsimilar communication devices may be included in the computer system202. Further, an automated mineralogy analyzer 210, an electronmicroscope 212, and a laser ablation inductively coupled plasma massspectrophotometer 214 can be directly connected to the networking device206. The networking device 206 may be wired or wireless networkingdevices that connect to the internet, a LAN, WAN, or other computingnetwork.

The components that are shown as being stored in the memory device 222may be executed by the processor 220. The term “executable” may mean aprogram file that is in a form that may be executed by a processor. Forexample, a program in a higher level language may be compiled intomachine code in a format that may be loaded into a random access portionof the memory device and executed by the processor 220, or source codemay be loaded by another executable program and interpreted to generateinstructions in a random access portion of the memory 222 to be executedby a processor 220. The executable program may be stored in any portionor component of the memory device 222. For example, the memory device222 may be random access memory (RAM), read only memory (ROM), flashmemory, a solid state drive, memory card, a hard drive, optical disk,floppy disk, magnetic tape, or any other memory components. Theprocessor 220 may represent multiple processors and the memory 222 mayrepresent multiple memory units that operate in parallel to theprocessing circuits. This may provide parallel processing channels forthe processes and data in the system 202. The local interface 226 may beused as a network to facilitate communication between any of themultiple processors and multiple memories. The local interface may useadditional systems designed for coordinating communication such as loadbalancing, bulk data transfer, and similar systems.

Once a sample is verified as originating from a conflict-free mine site,the metal from the mineral sample can be utilized to form a capacitor,as described in more detail below in sections II, III, and IV, or anyother electronic part, as discussed in section V.

II. Solid Electrolytic Capacitor Containing a Metal Component SourcedFrom a Conflict-Free Mine Site

After verifying that the previously unverified mineral sample containinga metal (e.g., gold, cobalt, copper, tin, tungsten, etc.) is sourcedfrom a conflict-free mine site in step 109, the metal of interest in themineral sample can be separated from other components in the sample andformed into one or more metal components of an electrolytic capacitor.In one particular embodiment, metal from the now-verified mineral samplecan be used to form one or more metal components of a solid electrolyticcapacitor that also includes an anode, a dielectric, and a solidelectrolyte. The various components of the solid electrolytic capacitorare discussed in more detail below.

A. Anode

The anode can include a valve metal can then be formed into a powder toform a porous anode body for use in the solid electrolytic capacitor ofthe present invention. The porous anode body is typically formed from avalve metal composition having a high specific charge, such as about5,000 μF*V/g or more, in some embodiments about 10,000 μF*V/g or more,in some embodiments about 20,000 μF*V/g or more. Such powders typicallyhave a specific charge of from about 10,000 to about 600,000 μF*V/g, insome embodiments from about 40,000 to about 500,000 μF*V/g, in someembodiments from about 50,000 to about 400,000 μF*V/g, in someembodiments from about 70,000 to about 350,000 μF*V/g , and in someembodiments, from about 150,000 to about 300,000 μF*V/g. The valve metalcomposition contains a valve metal (i.e., a metal that is capable ofoxidation) or a valve metal-based compound, such as tantalum, niobium,aluminum, hafnium, titanium, alloys thereof, oxides thereof, nitridesthereof, and so forth. Examples of such valve metal oxides are describedin U.S. Pat. No. 6,322,912 to Fife; U.S. Pat. No. 6,391,275 to Fife etal.; U.S. Pat. No. 6,416,730 to Fife et al.; U.S. Pat. No.6,527,937 toFife; U.S. Pat. No. 6,576,099 to Kimmel, et al.; U.S. Pat. No. 6,592,740to Fife, et al.; and U.S. Pat. No. 6,639,787 to Kimmel, et al.; and U.S.Pat. No. 7,220,397 to Kimmel, et al., as well as U.S. Patent ApplicationPublication Nos. 2005/0019581 to Schnitter; 2005/0103638 to Schnitter,et al.; 2005/0013765 to Thomas, et al., all of which are incorporatedherein in their entirety by reference thereto for all purposes.

To form the anode, a powder of the valve metal composition is generallyemployed. The powder may contain particles any of a variety of shapes,such as nodular, angular, flake, etc., as well as mixtures thereof.Particularly suitable powders are tantalum powders available from CabotCorp. (e.g., C255 flake powder, TU4D flake/nodular powder, etc.) andHeraeus (e.g., NH175 nodular powder). Although not required, the powdermay be agglomerated using any technique known in the art, such asthrough heat treatment. Prior to forming the powder into the shape of ananode, it may also be optionally mixed with a binder and/or lubricant toensure that the particles adequately adhere to each other when pressedto form the anode body. The resulting powder may then be compacted toform a pellet using any conventional powder press device. For example, apress mold may be employed that is a single station compaction presscontaining a die and one or multiple punches. Alternatively, anvil-typecompaction press molds may be used that use only a die and single lowerpunch. Single station compaction press molds are available in severalbasic types, such as cam, toggle/knuckle and eccentric/crank presseswith varying capabilities, such as single action, double action,floating die, movable platen, opposed ram, screw, impact, hot pressing,coining or sizing.

Regardless of its particular composition, the powder is compacted aroundthe anode lead so that at least a portion of the anode lead assemblyextends from the compacted porous anode body. In one particularembodiment, a press mold may be employed that includes a die having twoor more portions (e.g., upper and lower portions). During use, theportions of the die may be placed adjacent to each other so that theirwalls are substantially aligned to form a die cavity having the desiredshape of the anode. Before, during, and/or after loading a certainquantity of powder into the die cavity, the anode lead may be embeddedtherein. The die may define a single or multiple slots that allow forthe insertion of the anode lead. If more than one anode lead isemployed, the anode lead can be placed in close proximity to each otherin order to be sinter-bonded, although this is not required. Afterfilling the die with powder and embedding the anode lead(s) therein, thedie cavity may then be closed and subjected to compressive forces by apunch. Typically, the compressive forces are exerted in a direction thatis either generally parallel or generally perpendicular to the length“of the anode lead, which extends along a longitudinal axis. This forcesthe particles into close contact with the anode lead and creates astrong anode lead-to-powder bond.

Any binder/lubricant may be removed after pressing by heating the pelletunder vacuum at a certain temperature (e.g., from about 150° C. to about500° C.) for several minutes. Alternatively, the binder/lubricant mayalso be removed by contacting the pellet with an aqueous solution, suchas described in U.S. Pat. No. 6,197,252 to Bishop, et al., which isincorporated herein in its entirety by reference thereto for allpurposes. Thereafter, the porous anode body 33 is sintered to form aporous, integral mass. The pellet is typically sintered at a temperatureof from about 1200° C. to about 2000° C., in some embodiments from about1300° C. to about 1900° C., and in some embodiments, from about 1500° C.to about 1800° C., for a time of from about 5 minutes to about 100minutes, and in some embodiments, from about 30 minutes to about 60minutes. If desired, sintering may occur in an atmosphere that limitsthe transfer of oxygen atoms to the anode. For example, sintering mayoccur in a reducing atmosphere, such as in a vacuum, inert gas,hydrogen, etc. The reducing atmosphere may be at a pressure of fromabout 10 Torr to about 2000 Torr, in some embodiments from about 100Torr to about 1000 Torr, and in some embodiments, from about 100 Torr toabout 930 Torr. Mixtures of hydrogen and other gases (e.g., argon ornitrogen) may also be employed.

B. Dielectric

Once constructed, a dielectric layer may be formed by anodicallyoxidizing (“anodizing”) the sintered anode body. The dielectric may beformed by anodically oxidizing (“anodizing”) the sintered anode so thata dielectric layer is formed over and/or within the anode body. Forexample, a tantalum (Ta) anode may be anodized to tantalum pentoxide(Ta₂O₅). Typically, anodization is performed by initially applying anelectrolyte to the anode, such as by dipping anode into the electrolyte.The electrolyte is generally in the form of a liquid, such as a solution(e.g., aqueous or non-aqueous), dispersion, melt, etc. A solvent isgenerally employed in the electrolyte, such as water (e.g., deionizedwater); ethers (e.g., diethyl ether and tetrahydrofuran); alcohols(e.g., methanol, ethanol, n-propanol, isopropanol, and butanol);triglycerides; ketones (e.g., acetone, methyl ethyl ketone, and methylisobutyl ketone); esters (e.g., ethyl acetate, butyl acetate, diethyleneglycol ether acetate, and methoxypropyl acetate); amides (e.g.,dimethylformamide, dimethylacetamide, dimethylcaprylic/capric fatty acidamide and N-alkylpyrrolidones); nitriles (e.g., acetonitrile,propionitrile, butyronitrile and benzonitrile); sulfoxides or sulfones(e.g., dimethyl sulfoxide (DMSO) and sulfolane); and so forth. Thesolvent may constitute from about 50 wt. % to about 99.9 wt. %, in someembodiments from about 75 wt. % to about 99 wt. %, and in someembodiments, from about 80 wt. % to about 95 wt. % of the electrolyte.Although not necessarily required, the use of an aqueous solvent (e.g.,water) is often desired to help achieve the desired oxide. In fact,water may constitute about 50 wt. % or more, in some embodiments, about70 wt. % or more, and in some embodiments, about 90 wt. % to 100 wt. %of the solvent(s) used in the electrolyte.

The electrolyte is ionically conductive and may have an ionicconductivity of about 1 milliSiemens per centimeter (“mS/cm”) or more,in some embodiments about 30 mS/cm or more, and in some embodiments,from about 40 mS/cm to about 100 mS/cm, determined at a temperature of25° C. To enhance the ionic conductivity of the electrolyte, a compoundmay be employed that is capable of dissociating in the solvent to formions. Suitable ionic compounds for this purpose may include, forinstance, acids, such as hydrochloric acid, nitric acid, sulfuric acid,phosphoric acid, polyphosphoric acid, boric acid, boronic acid, etc.;organic acids, including carboxylic acids, such as acrylic acid,methacrylic acid, malonic acid, succinic acid, salicylic acid,sulfosalicylic acid, adipic acid, maleic acid, malic acid, oleic acid,gallic acid, tartaric acid, citric acid, formic acid, acetic acid,glycolic acid, oxalic acid, propionic acid, phthalic acid, isophthalicacid, glutaric acid, gluconic acid, lactic acid, aspartic acid,glutaminic acid, itaconic acid, trifluoroacetic acid, barbituric acid,cinnamic acid, benzoic acid, 4-hydroxybenzoic acid, aminobenzoic acid,etc.; sulfonic acids, such as methanesulfonic acid, benzenesulfonicacid, toluenesulfonic acid, trifluoromethanesulfonic acid,styrenesulfonic acid, naphthalene disulfonic acid,hydroxybenzenesulfonic acid, dodecylsulfonic acid,dodecylbenzenesulfonic acid, etc.; polymeric acids, such aspoly(acrylic) or poly(methacrylic) acid and copolymers thereof (e.g.,maleic-acrylic, sulfonic-acrylic, and styrene-acrylic copolymers),carageenic acid, carboxymethyl cellulose, alginic acid, etc.; and soforth. The concentration of ionic compounds is selected to achieve thedesired ionic conductivity. For example, an acid (e.g., phosphoric acid)may constitute from about 0.01 wt. % to about 5 wt. %, in someembodiments from about 0.05 wt. % to about 0.8 wt. %, and in someembodiments, from about 0.1 wt. % to about 0.5 wt. % of the electrolyte.If desired, blends of ionic compounds may also be employed in theelectrolyte.

A current is passed through the electrolyte to form the dielectriclayer. The value of voltage manages the thickness of the dielectriclayer. For example, the power supply may be initially set up at agalvanostatic mode until the required voltage is reached. Thereafter,the power supply may be switched to a potentiostatic mode to ensure thatthe desired dielectric thickness is formed over the surface of theanode. Of course, other known methods may also be employed, such aspulse or step potentiostatic methods. The voltage typically ranges fromabout 4 to about 200 V, and in some embodiments, from about 9 to about100 V. During anodic oxidation, the electrolyte can be kept at anelevated temperature, such as about 30° C. or more, in some embodimentsfrom about 40° C. to about 200° C., and in some embodiments, from about50° C. to about 100° C. Anodic oxidation can also be done at ambienttemperature or lower. The resulting dielectric layer may be formed on asurface of the anode and within its pores.

Although not required, in certain embodiments, the dielectric layer maypossess a differential thickness throughout the anode body in that itpossesses a first portion that overlies an external surface of the anodebody and a second portion that overlies an interior surface of the anodebody. In such embodiments, the first portion is selectively formed sothat its thickness is greater than that of the second portion. It shouldbe understood, however, that the thickness of the dielectric layer neednot be uniform within a particular region. Certain portions of thedielectric layer adjacent to the external surface may, for example,actually be thinner than certain portions of the layer at the interiorsurface, and vice versa. Nevertheless, the dielectric layer may beformed such that at least a portion of the layer at the external surfacehas a greater thickness than at least a portion at the interior surface.Although the exact difference in these thicknesses may vary depending onthe particular application, the ratio of the thickness of the firstportion to the thickness of the second portion is typically from about1.2 to about 40, in some embodiments from about 1.5 to about 25, and insome embodiments, from about 2 to about 20.

To form a dielectric layer having a differential thickness, amulti-stage process is generally employed. In each stage of the process,the sintered anode body is anodically oxidized (“anodized”) to form adielectric layer (e.g., tantalum pentoxide). During the first stage ofanodization, a relatively small forming voltage is typically employed toensure that the desired dielectric thickness is achieved for the innerregion, such as forming voltages ranging from about 1 to about 90 volts,in some embodiments from about 2 to about 50 volts, and in someembodiments, from about 5 to about 20 volts. Thereafter, the sinteredbody may then be anodically oxidized in a second stage of the process toincrease the thickness of the dielectric to the desired level. This isgenerally accomplished by anodizing in an electrolyte at a highervoltage than employed during the first stage, such as at formingvoltages ranging from about 50 to about 350 volts, in some embodimentsfrom about 60 to about 300 volts, and in some embodiments, from about 70to about 200 volts. During the first and/or second stages, theelectrolyte may be kept at a temperature within the range of from about15° C. to about 95° C., in some embodiments from about 20° C. to about90° C., and in some embodiments, from about 25° C. to about 85° C.

The electrolytes employed during the first and second stages of theanodization process may be the same or different. Typically, however, itis desired to employ different solutions to help better facilitate theattainment of a higher thickness at the outer portions of the dielectriclayer. For example, it may be desired that the electrolyte employed inthe second stage has a lower ionic conductivity than the electrolyteemployed in the first stage to prevent a significant amount of oxidefilm from forming on the internal surface of anode body. In this regard,the electrolyte employed during the first stage may contain an acidiccompound, such as hydrochloric acid, nitric acid, sulfuric acid,phosphoric acid, polyphosphoric acid, boric acid, boronic acid, etc.Such an electrolyte may have an electrical conductivity of from about0.1 to about 100 mS/cm, in some embodiments from about 0.2 to about 20mS/cm, and in some embodiments, from about 1 to about 10 mS/cm,determined at a temperature of 25° C. The electrolyte employed duringthe second stage typically contains a salt of a weak acid so that thehydronium ion concentration increases in the pores as a result of chargepassage therein. Ion transport or diffusion is such that the weak acidanion moves into the pores as necessary to balance the electricalcharges. As a result, the concentration of the principal conductingspecies (hydronium ion) is reduced in the establishment of equilibriumbetween the hydronium ion, acid anion, and undissociated acid, thusforms a poorer-conducting species. The reduction in the concentration ofthe conducting species results in a relatively high voltage drop in theelectrolyte, which hinders further anodization in the interior while athicker oxide layer is being built up on the outside to a higherformation voltage in the region of continued high conductivity. Suitableweak acid salts may include, for instance, ammonium or alkali metalsalts (e.g., sodium, potassium, etc.) of boric acid, boronic acid,acetic acid, oxalic acid, lactic acid, adipic acid, etc. Particularlysuitable salts include sodium tetraborate and ammonium pentaborate. Suchelectrolytes typically have an electrical conductivity of from about 0.1to about 20 mS/cm, in some embodiments from about 0.5 to about 10 mS/cm,and in some embodiments, from about 1 to about 5 mS/cm, determined at atemperature of 25° C.

If desired, each stage of anodization may be repeated for one or morecycles to achieve the desired dielectric thickness. Furthermore, theanode body may also be rinsed or washed with another solvent (e.g.,water) after the first and/or second stages to remove the electrolyte.

C. Solid Electrolyte

A solid electrolyte overlies the dielectric that generally functions asthe cathode for the capacitor. In one embodiment, the cathode of thesolid electrolytic capacitor can be made principally from manganesedioxide and can be formed by a process generically termed manganizing.In this process, a conductive counter electrode coating is formed overthe dielectric formed from anodizing. The manganizing step is typicallyperformed by dipping the anodized device in a solution of manganousnitrate and heating the impregnated device in a moist atmosphere toconvert the nitrate to a solid conductive manganese dioxide. In otherwords, a manganese dioxide solid electrolyte may be formed by thepyrolytic decomposition of manganous nitrate (Mn(NO₃)₂).

In another embodiment, the solid electrolyte may also be formed from oneor more conductive polymer layers. For instance, the solid electrolytecan contain a conductive polymer, which is typically 7-conjugated andhave electrical conductivity after oxidation or reduction, such as anelectrical conductivity of at least about 1 μS/cm. Examples of such7-conjugated conductive polymers include, for instance, polyheterocycles(e.g., polypyrroles, polythiophenes, polyanilines, etc.),polyacetylenes, poly-p-phenylenes, polyphenolates, and so forth.Suitable polythiophenes may include, for instance, polythiophene andderivatives thereof, such as poly(3,4-ethylenedioxythiophene) (“PEDT”).In one particular embodiment, a polythiophene derivative is employedwith recurring units of general formula (I) or formula (II) or recurringunits of general formulae (I) and (II):

wherein,

A is an optionally substituted C₁ to C₅ alkylene radical (e.g.,methylene, ethylene, n-propylene, n-butylene, n-pentylene, etc.);

R is a linear or branched, optionally substituted C₁ to C₁₈ alkylradical (e.g., methyl, ethyl, n- or iso-propyl, n-, iso-, sec- ortert-butyl, n-pentyl, 1-methylbutyl, 2-methylbutyl, 3-methylbutyl,1-ethylpropyl, 1,1-dimethylpropyl, 1,2-dimethylpropyl,2,2-dimethylpropyl, n-hexyl, n-heptyl, n-octyl, 2-ethylhexyl, n-nonyl,n-decyl, n-undecyl, n-dodecyl, n-tridecyl, n-tetradecyl, n-hexadecyl,n-octadecyl, etc.); optionally substituted C₅ to C₁₂ cycloalkyl radical(e.g., cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, cyclononylcyclodecyl, etc.); optionally substituted C₆ to C₁₄ aryl radical (e.g.,phenyl, naphthyl, etc.); optionally substituted C₇ to C₁₈ aralkylradical (e.g., benzyl, o-, m-, p-tolyl, 2,3-, 2,4-, 2,5-, 2-6, 3-4-,3,5-xylyl, mesityl, etc.); optionally substituted C₁ to C₄ hydroxyalkylradical, or hydroxyl radical; and

x is an integer from 0 to 8, in some embodiments, from 0 to 2, and insome embodiments, x is 0. Example of substituents for the radicals “A”or “R” include, for instance, alkyl, cycloalkyl, aryl, aralkyl, alkoxy,halogen, ether, thioether, disulphide, sulfoxide, sulfone, sulfonate,amino, aldehyde, keto, carboxylic acid ester, carboxylic acid,carbonate, carboxylate, cyano, alkylsilane and alkoxysilane groups,carboxylamide groups, and so forth.

The total number of recurring units of general formula (I) or formula(II) or of general formulae (I) and (II) is typically from 2 to 2,000,and in some embodiments, from 2 to 100.

Particularly suitable polythiophene derivatives are those in which “A”is an optionally substituted C₂ to C₃ alkylene radical and x is 0 or 1.In one particular embodiment, the polythiophene derivative is PEDT andhas recurring units of formula (II), wherein “A” is CH₂-CH₂ and “x” is0. Methods for forming such polythiophene derivatives are well known inthe art and described, for instance, in U.S. Pat. No. 6,987,663 toMerker, et al., which is incorporated herein in its entirety byreference thereto for all purposes. For example, the polythiophenederivatives may be formed from a monomeric precursor, such as optionallysubstituted thiophenes. Particularly suitable monomeric precursors aresubstituted 3,4-alkylenedioxythiophenes having the general formula(III), (IV) or a mixture of thiophene of general formulae (III) and(IV):

wherein, A, R, and X are as defined above.

Examples of such monomeric precursors include, for instance, optionallysubstituted 3,4-ethylenedioxythiophenes. Derivatives of these monomericprecursors may also be employed that are, for example, dimers or trimersof the above monomeric precursors. Higher molecular derivatives, i.e.,tetramers, pentamers, etc. of the monomeric precursors are suitable foruse in the present invention. The derivatives may be made up ofidentical or different monomer units and used in pure form and in amixture with one another and/or with the monomeric precursors. Oxidizedor reduced forms of these precursors may also be employed.

To produce the desired conductive polymer, monomeric precursors, such asdescribed above, typically undergo oxidative polymerization in thepresence of an oxidizing agent. The oxidizing agent may be a transitionmetal salt, such as a salt of an inorganic or organic acid that containiron(III), copper(II), chromium(VI), cerium(IV), manganese(IV),manganese(VII), or ruthenium(III) cations. Particularly suitabletransition metal salts include iron(III) cations, such as iron(III)halides (e.g., FeCl₃) or iron(III) salts of other inorganic acids, suchas Fe(ClO₄)₃ or Fe₂(SO₄)₃ and the iron(III) salts of organic acids andinorganic acids comprising organic radicals. Examples of iron (III)salts of inorganic acids with organic radicals include, for instance,iron(III) salts of sulfuric acid monoesters of C₁ to C₂₀ alkanols (e.g.,iron(III) salt of lauryl sulfate). Likewise, examples of iron(III) saltsof organic acids include, for instance, iron(III) salts of C₁ to C₂₀alkane sulfonic acids (e.g., methane, ethane, propane, butane, ordodecane sulfonic acid); iron (III) salts of aliphatic perfluorosulfonicacids (e.g., trifluoromethane sulfonic acid, perfluorobutane sulfonicacid, or perfluorooctane sulfonic acid); iron (III) salts of aliphaticC₁ to C₂₀ carboxylic acids (e.g., 2-ethylhexylcarboxylic acid); iron(III) salts of aliphatic perfluorocarboxylic acids (e.g.,trifluoroacetic acid or perfluorooctane acid); iron (III) salts ofaromatic sulfonic acids optionally substituted by C₁ to C₂₀ alkyl groups(e.g., benzene sulfonic acid, o-toluene sulfonic acid, p-toluenesulfonic acid, or dodecylbenzene sulfonic acid); iron (III) salts ofcycloalkane sulfonic acids (e.g., camphor sulfonic acid); and so forth.Mixtures of these above-mentioned iron(III) salts may also be used.Iron(III)-p-toluene sulfonate, iron(III)-o-toluene sulfonate, andmixtures thereof, are particularly suitable for use in the presentinvention.

Various methods may be utilized to apply the solid electrolyte onto theanode part. In one embodiment, the oxidizing agent and monomericprecursor are applied, either sequentially or together, such that thepolymerization reaction occurs in situ on the part. Suitable applicationtechniques may include screen-printing, dipping, electrophoreticcoating, and spraying, may be used to form a conductive polymer coating.As an example, the monomeric precursor (e.g.,3,4-ethylenedioxy-thiophene) may initially be mixed with the oxidizingagent to form a solution. One suitable oxidizing agent is CLEVIOS™ C,which is iron III toluene-sulfonate and sold by Heraeus. CLEVIOS™ C is acommercially available catalyst for CLEVIOS™ M, which is 3,4-ethylenedioxythiophene, a PEDT monomer also sold by Heraeus. Once the mixture isformed, the anode part may then be dipped into the solution so that thepolymer forms on the surface of the anode part.

Alternatively, the oxidizing agent and precursor may also be appliedseparately to the anode part. In one embodiment, for example, theoxidizing agent is dissolved in an organic solvent (e.g., butanol) andthen applied to the anode part as a dipping solution. The anode part maythen be dried to remove the solvent therefrom. Thereafter, the anodepart may be dipped into a solution containing the appropriate monomer.

As the monomer contacts the surface of the anode part containing theoxidizing agent, it may chemically polymerize thereon. Polymerizationmay be performed at temperatures of from about −10° C. to about 250° C.,and in some embodiments, from about 0° C. to about 200° C., depending onthe oxidizing agent used and desired reaction time. Suitablepolymerization techniques, such as described above, may be described inmore detail in U.S. Publication No. 2008/232037 to Biler. Still othermethods for applying such conductive polymer coating(s) may be describedin U.S. Pat. No. 5,457,862 to Sakata, et al., U.S. Pat. No. 5,473,503 toSakata, et al., U.S. Pat. No. 5,729,428 to Sakata, et al., and U.S. Pat.No. 5,812,367 to Kudoh, et al., which are incorporated herein in theirentirety by reference thereto for all purposes.

In addition to in situ application, the solid electrolyte may also beapplied to the part in the form of a dispersion of solid conductivepolymer particles. Although their size may vary, it is typically desiredthat the particles possess a small diameter to increase the surface areaavailable for adhering to the anode part. To enable good impregnation ofthe anode body, the particles employed in the dispersion typically havea small size, such as an average size (e.g., diameter) of from about 1to about 150 nanometers, in some embodiments from about 2 to about 50nanometers, and in some embodiments, from about 5 to about 40nanometers. The diameter of the particles may be determined using knowntechniques, such as by ultracentrifuge, laser diffraction, etc. Theshape of the particles may likewise vary. In one particular embodiment,for instance, the particles are spherical in shape. However, it shouldbe understood that other shapes are also contemplated by the presentinvention, such as plates, rods, discs, bars, tubes, irregular shapes,etc. The concentration of the particles in the dispersion may varydepending on the desired viscosity of the dispersion and the particularmanner in which the dispersion is to be applied to the capacitor.Typically, however, the particles constitute from about 0.1 to about 10wt. %, in some embodiments from about 0.4 to about 5 wt. %, and in someembodiments, from about 0.5 to about 4 wt. % of the dispersion.

The formation of the conductive polymers into a particulate form may beenhanced by using a separate counterion to counteract a chargedconductive polymer (e.g., polythiophene). That is, the conductivepolymer (e.g., polythiophene or derivative thereof) used in the solidelectrolyte typically has a charge on the main polymer chain that isneutral or positive (cationic). Polythiophene derivatives, for instance,typically carry a positive charge in the main polymer chain. In somecases, the polymer may possess positive and negative charges in thestructural unit, with the positive charge being located on the mainchain and the negative charge optionally on the substituents of theradical “R”, such as sulfonate or carboxylate groups. The positivecharges of the main chain may be partially or wholly saturated with theoptionally present anionic groups on the radicals “R.” Viewed overall,the polythiophenes may, in these cases, be cationic, neutral or evenanionic. Nevertheless, they are all regarded as cationic polythiophenesas the polythiophene main chain has a positive charge.

The counterion may be a monomeric or polymeric anion. Polymeric anionscan, for example, be anions of polymeric carboxylic acids (e.g.,polyacrylic acids, polymethacrylic acid, polymaleic acids, etc.);polymeric sulfonic acids (e.g., polystyrene sulfonic acids (“PSS”),polyvinyl sulfonic acids, etc.); and so forth. The acids may also becopolymers, such as copolymers of vinyl carboxylic and vinyl sulfonicacids with other polymerizable monomers, such as acrylic acid esters andstyrene. Likewise, suitable monomeric anions include, for example,anions of C₁ to C₂₀ alkane sulfonic acids (e.g., dodecane sulfonicacid); aliphatic perfluorosulfonic acids (e.g., trifluoromethanesulfonic acid, perfluorobutane sulfonic acid or perfluorooctane sulfonicacid); aliphatic C₁ to C₂₀ carboxylic acids (e.g.,2-ethyl-hexylcarboxylic acid); aliphatic perfluorocarboxylic acids(e.g., trifluoroacetic acid or perfluorooctanoic acid); aromaticsulfonic acids optionally substituted by C₁ to C₂₀ alkyl groups (e.g.,benzene sulfonic acid, o-toluene sulfonic acid, p-toluene sulfonic acidor dodecylbenzene sulfonic acid); cycloalkane sulfonic acids (e.g.,camphor sulfonic acid or tetrafluoroborates, hexafluorophosphates,perchlorates, hexafluoroantimonates, hexafluoroarsenates orhexachloroantimonates); and so forth. Particularly suitablecounteranions are polymeric anions, such as a polymeric carboxylic orsulfonic acid (e.g., polystyrene sulfonic acid (“PSS”)). The molecularweight of such polymeric anions typically ranges from about 1,000 toabout 2,000,000, and in some embodiments, from about 2,000 to about500,000.

When employed, the weight ratio of such counterions to conductivepolymers in a given layer of the solid electrolyte is typically fromabout 0.5:1 to about 50:1, in some embodiments from about 1:1 to about30:1, and in some embodiments, from about 2:1 to about 20:1. The weightof the electrically conductive polymers corresponds referred to theabove-referenced weight ratios refers to the weighed-in portion of themonomers used, assuming that a complete conversion occurs duringpolymerization.

In addition to conductive polymer(s) and optional counterion(s), thedispersion may also contain one or more binders to further enhance theadhesive nature of the polymeric layer and also increase the stabilityof the particles within the dispersion. The binders may be organic innature, such as polyvinyl alcohols, polyvinyl pyrrolidones, polyvinylchlorides, polyvinyl acetates, polyvinyl butyrates, polyacrylic acidesters, polyacrylic acid amides, polymethacrylic acid esters,polymethacrylic acid amides, polyacrylonitriles, styrene/acrylic acidester, vinyl acetate/acrylic acid ester and ethylene/vinyl acetatecopolymers, polybutadienes, polyisoprenes, polystyrenes, polyethers,polyesters, polycarbonates, polyurethanes, polyam ides, polyim ides,polysulfones, melamine formaldehyde resins, epoxide resins, siliconeresins or celluloses. Crosslinking agents may also be employed toenhance the adhesion capacity of the binders. Such crosslinking agentsmay include, for instance, melamine compounds, masked isocyanates orfunctional silanes, such as 3-glycidoxypropyltrialkoxysilane,tetraethoxysilane and tetraethoxysilane hydrolysate or crosslinkablepolymers, such as polyurethanes, polyacrylates or polyolefins, andsubsequent crosslinking.

Dispersion agents may also be employed to facilitate the formation ofthe solid electrolyte and the ability to apply it to the anode part.Suitable dispersion agents include solvents, such as aliphatic alcohols(e.g., methanol, ethanol, i-propanol and butanol), aliphatic ketones(e.g., acetone and methyl ethyl ketones), aliphatic carboxylic acidesters (e.g., ethyl acetate and butyl acetate), aromatic hydrocarbons(e.g., toluene and xylene), aliphatic hydrocarbons (e.g., hexane,heptane and cyclohexane), chlorinated hydrocarbons (e.g.,dichloromethane and dichloroethane), aliphatic nitriles (e.g.,acetonitrile), aliphatic sulfoxides and sulfones (e.g., dimethylsulfoxide and sulfolane), aliphatic carboxylic acid amides (e.g.,methylacetamide, dimethylacetamide and dimethylformamide), aliphatic andaraliphatic ethers (e.g., diethylether and anisole), water, and mixturesof any of the foregoing solvents. A particularly suitable dispersionagent is water.

In addition to those mentioned above, still other ingredients may alsobe used in the dispersion. For example, conventional fillers may be usedthat have a size of from about 10 nanometers to about 100 micrometers,in some embodiments from about 50 nanometers to about 50 micrometers,and in some embodiments, from about 100 nanometers to about 30micrometers. Examples of such fillers include calcium carbonate,silicates, silica, calcium or barium sulfate, aluminum hydroxide, glassfibers or bulbs, wood flour, cellulose powder carbon black, electricallyconductive polymers, etc. The fillers may be introduced into thedispersion in powder form, but may also be present in another form, suchas fibers.

Surface-active substances may also be employed in the dispersion, suchas ionic or non-ionic surfactants. Furthermore, adhesives may beemployed, such as organofunctional silanes or their hydrolysates, forexample 3-glycidoxypropyltrialkoxysilane, 3-aminopropyl-triethoxysilane,3-mercaptopropyl-trimethoxysilane, 3-metacryloxypropyltrimethoxysilane,vinyltrimethoxysilane or octyltriethoxysilane. The dispersion may alsocontain additives that increase conductivity, such as ethergroup-containing compounds (e.g., tetrahydrofuran), lactonegroup-containing compounds (e.g., y-butyrolactone or y-valerolactone),amide or lactam group-containing compounds (e.g., caprolactam,N-methylcaprolactam, N,N-dimethylacetamide, N-methylacetamide,N,N-dimethylformamide (DMF), N-methylformamide, N-methylformanilide,N-methylpyrrolidone (NMP), N-octylpyrrolidone, or pyrrolidone), sulfonesand sulfoxides (e.g., sulfolane (tetramethylenesulfone) ordimethylsulfoxide (DMSO)), sugar or sugar derivatives (e.g., saccharose,glucose, fructose, or lactose), sugar alcohols (e.g., sorbitol ormannitol), furan derivatives (e.g., 2-furancarboxylic acid or3-furancarboxylic acid), and alcohols (e.g., ethylene glycol, glycerol,di- or triethylene glycol).

The polymeric dispersion may be applied to the part using a variety ofknown techniques, such as by spin coating, impregnation, pouring,dropwise application, injection, spraying, doctor blading, brushing orprinting (e.g., ink-jet, screen, or pad printing). Although it may varydepending on the application technique employed, the viscosity of thedispersion is typically from about 0.1 to about 100,000 mPa·s (measuredat a shear rate of 100 s⁻¹), in some embodiments from about 1 to about10,000 mPa·s, in some embodiments from about 10 to about 1,500 mPa·s,and in some embodiments, from about 100 to about 1000 mPa·s. Onceapplied, the layer may be dried and washed. One or more additionallayers may also be formed in this manner to achieve the desiredthickness. Typically, the total thickness of the layer(s) formed by thisparticle dispersion is from about 1 to about 50 μm, and in someembodiments, from about 5 to about 20 μm. The weight ratio ofcounterions to conductive polymers is likewise from about 0.5:1 to about50:1, in some embodiments from about 1:1 to about 30:1, and in someembodiments, from about 2:1 to about 20:1.

In addition to applying the solid electrolyte via in situ polymerizationor via the application of a dispersion of conductive polymer particles,it is also to be understood that the solid electrolyte can be appliedvia a hybrid process that combines both in situ polymerization and theapplication of a dispersion of conductive polymer particles. Forexample, in one embodiment, a capacitor element can include a solidelectrolyte formed from multiple layers. More specifically, the solidelectrolyte can include a first conductive polymer layer that is incontact with a dielectric that overlies an anode body. The first layermay contain a conductive polymer (e.g., PEDT) that is formed through insitu polymerization of an oxidizing agent and monomeric precursor. Thesolid electrolyte can also contain a second conductive polymer layerthat generally overlies the first layer. The second layer may be formedfrom a dispersion of particles that contains a conductive polymer (e.g.,PEDT), binder, and an optional counterion (e.g., PSS). One benefit ofemploying such a dispersion is that it may be able to penetrate into theedge region of the capacitor body to achieve good electrical contactwith the inner layer and increase the adhesion to the capacitor body.This results in a more mechanically robust part, which may reduceequivalent series resistance and leakage current. On the other hand, inanother embodiment, the solid electrolyte may be a single conductivepolymer layer. Regardless of how many layers it includes, the resultingsolid electrolyte typically has a total thickness of from about 1micrometer (μm) to about 200 μm, in some embodiments from about 2 μm toabout 50 μm, and in some embodiments, from about 5 μm to about 30 μm.Further, if the solid electrolyte includes two layers such as an innerlayer and an outer layer, the inner layer may have a total thickness offrom about 0.1 pm to about 100 μm, in some embodiments from about 0.5 μmto about 20 μm, and in some embodiments, from about 1 μm to about 5 μm,while the outer layer may have a total thickness of from about 0.2 μm toabout 100 μm, in some embodiments from about 1 μm to about 40 μm, and insome embodiments, from about 3 μm to about 10 μm.

Regardless of the particular manner in which it is formed, the solidelectrolyte may be healed upon application to the anode part. Healingmay occur after each application of a solid electrolyte layer or mayoccur after the application of the entire coating if multiple layers areemployed. In some embodiments, for example, the solid electrolyte may behealed by dipping the pellet into an electrolyte solution, such as asolution of acid, and thereafter applying a constant voltage to thesolution until the current is reduced to a preselected level. Ifdesired, such healing may be accomplished in multiple steps. Afterapplication of some or all of the layers described above, the resultingpart may then be washed if desired to remove various byproducts, excessoxidizing agents, and so forth. Further, in some instances, drying maybe utilized after some or all of the dipping operations described above.For example, drying may be desired after applying the oxidizing agentand/or after washing the pellet in order to open the pores of the partso that it can receive a liquid during subsequent dipping steps.

D. Additional Layers

If desired, the capacitor may also contain other layers as is known inthe art. For example, a protective coating may optionally be formedbetween the dielectric and solid electrolyte, such as one made of arelatively insulative resinous material (natural or synthetic). Suchmaterials may have a specific resistivity of greater than about 10 W/cm,in some embodiments greater than about 100, in some embodiments greaterthan about 1,000 W/cm, in some embodiments greater than about 1×105W/cm, and in some embodiments, greater than about 1×1010 W/cm. Someresinous materials that may be utilized in the present inventioninclude, but are not limited to, polyurethane, polystyrene, esters ofunsaturated or saturated fatty acids (e.g., glycerides), and so forth.For instance, suitable esters of fatty acids include, but are notlimited to, esters of lauric acid, myristic acid, palmitic acid, stearicacid, eleostearic acid, oleic acid, linoleic acid, linolenic acid,aleuritic acid, shellolic acid, and so forth. These esters of fattyacids have been found particularly useful when used in relativelycomplex combinations to form a “drying oil”, which allows the resultingfilm to rapidly polymerize into a stable layer. Such drying oils mayinclude mono-, di-, and/or tri-glycerides, which have a glycerolbackbone with one, two, and three, respectively, fatty acyl residuesthat are esterified. For instance, some suitable drying oils that may beused include, but are not limited to, olive oil, linseed oil, castoroil, tung oil, soybean oil, and shellac. These and other protectivecoating materials are described in more detail U.S. Pat. No. 6,674,635to Fife, et al., which is incorporated herein in its entirety byreference thereto for all purposes.

The anode part may also be applied with a carbon layer (e.g., graphite)and silver layer, respectively. The silver coating may, for instance,act as a solderable conductor, contact layer, and/or charge collectorfor the capacitor and the carbon coating may limit contact of the silvercoating with the solid electrolyte. Such coatings may cover some or allof the solid electrolyte.

E. Terminations

The capacitor may also be provided with terminations, particularly whenemployed in surface mounting applications. For example, the capacitormay contain an anode termination to which the anode of the capacitorelement is electrically connected and a cathode termination to which thecathode of the capacitor element is electrically connected. Anyconductive material may be employed to form the terminations, such as aconductive metal (e.g., copper, gold, tungsten, cobalt, tin, silver,nickel, zinc, palladium, lead, aluminum, molybdenum, titanium, iron,zirconium, magnesium, and alloys thereof). Particularly suitableconductive metals include, for instance, copper, gold, tungsten, cobalt,and tin, where the source of the gold, copper, tin, or tungsten can beverified to be from a conflict-free geographic region using the methodsdescribed herein. The thickness of the terminations is generallyselected to minimize the thickness of the capacitor. For instance, thethickness of the terminations may range from about 0.05 to about 1millimeter, in some embodiments from about 0.05 to about 0.5millimeters, and from about 0.07 to about 0.2 millimeters. One exemplaryconductive material is a copper-iron alloy metal plate available fromWieland (Germany). If desired, the surface of the terminations may beelectroplated with gold, copper, cobalt, tin, tungsten, etc. as is knownin the art to ensure that the final part is mountable to the circuitboard. In one particular embodiment, both surfaces of the terminationscan be plated with gold flashes, while the mounting surface is alsoplated with a tin solder layer, where the source of the gold and tin canbe verified to be from a conflict-free geographic region using themethods described herein.

Referring to FIG. 3, for example, an electrolytic capacitor 30 is shownas including an anode termination 62 and a cathode termination 72 inelectrical connection with the capacitor element 33, where the capacitorelement 33 includes the porous anode body, dielectric, and solidelectrolyte components discussed above. The capacitor element 33 has anupper surface 37, lower surface 39, front surface 36, and rear surface38. Although it may be in electrical contact with any of the surfaces ofthe capacitor element 33, the cathode termination 72 in the illustratedembodiment is in electrical contact with the lower surface 39 via aconductive adhesive (not shown). More specifically, the cathodetermination 72 contains a first component 73 that is in electricalcontact and generally parallel with the lower surface 39 of thecapacitor element 33. The anode termination 62 likewise contains a firstcomponent 63 positioned substantially perpendicular to a secondcomponent 64. The first component 63 is in electrical contact andgenerally parallel with the lower surface 39 of the capacitor element33. The second component 64 contains a region 51 that carries an anodelead 16. The region 51 may possess a “U-shape” to further enhancesurface contact and mechanical stability of the lead 16.

The terminations may be connected to the capacitor element using anytechnique known in the art. In one embodiment, for example, a lead framemay be provided that defines the cathode termination 72 and anodetermination 62, where the lead frame can be formed from gold, cobalt,copper, tin, or tungsten that is verified to be obtained from aconflict-free mine site according to the methods described herein. Toattach the electrolytic capacitor element 33 to the lead frame, theconductive adhesive (not shown) may initially be applied to a surface ofthe cathode termination 72. The conductive adhesive may include, forinstance, conductive metal particles contained with a resin composition.The metal particles may be copper or gold, where the source of thecopper and gold can be verified to be from a conflict-free mine siteusing the methods described herein. The resin composition may include athermoset resin (e.g., epoxy resin), curing agent (e.g., acidanhydride), and coupling agent (e.g., silane coupling agents). Suitableconductive adhesives may be described in U.S. Patent Publication No.2006/0038304 to Osako, et al. Any of a variety of techniques may be usedto apply the conductive adhesive to the cathode termination 72. Printingtechniques, for instance, may be employed due to their practical andcost-saving benefits.

A variety of methods may generally be employed to attach theterminations to the capacitor. In one embodiment, for example, thesecond component 64 of the anode termination 62 is initially bent upwardto the position shown in FIG. 3. Thereafter, the capacitor element 33 ispositioned on the cathode termination 72 so that its lower surface 39contacts the adhesive 90 and the anode lead 16 is received by the region51. If desired, an insulating material (not shown), such as a plasticpad or tape, may be positioned between the lower surface 39 of thecapacitor element 33 and the first component 63 of the anode termination62 to electrically isolate the anode and cathode terminations.

The anode lead 16 is then electrically connected to the region 51 usingany technique known in the art, such as mechanical welding, laserwelding, conductive adhesives, etc. For example, the anode lead 16 maybe welded to the anode termination 62 using a laser. Lasers generallycontain resonators that include a laser medium capable of releasingphotons by stimulated emission and an energy source that excites theelements of the laser medium. One type of suitable laser is one in whichthe laser medium consist of an aluminum and yttrium garnet (YAG), dopedwith neodymium (Nd). The excited particles are neodymium ions Nd³⁺. Theenergy source may provide continuous energy to the laser medium to emita continuous laser beam or energy discharges to emit a pulsed laserbeam. Upon electrically connecting the anode lead 16 to the anodetermination 62, the conductive adhesive may then be cured. For example,a heat press may be used to apply heat and pressure to ensure that theelectrolytic capacitor element 33 is adequately adhered to the cathodetermination 72 by the adhesive.

F. Casing

The capacitor element is generally encapsulated within a casing so thatat least a portion of the anode and cathode terminations are exposed formounting onto a circuit board. As shown in FIG. 3, for instance, thecapacitor element 33 is encapsulated within a resinous casing 28 so thata portion of the anode termination 62 and a portion of the cathodetermination 72 are exposed. The casing is typically formed from athermoset resin. Examples of such resins include, for instance, epoxyresins, polyimide resins, melamine resins, urea-formaldehyde resins,polyurethane resins, phenolic resins, polyester resins, etc. Epoxyresins are also particularly suitable. Still other additives may also beemployed, such as photoinitiators, viscosity modifiers, suspensionaiding agents, pigments, stress reducing agents, non-conductive fillers,stabilizers, etc. For example, the non-conductive fillers may includeinorganic oxide particles, such as silica, alumina, zirconia, magnesiumoxide, iron oxide, copper oxide, zeolites, silicates, clays (e.g.,smectite clay), etc., as well as composites (e.g., alumina-coated silicaparticles) and mixtures thereof.

III. Wet Electrolytic Capacitor Containing a Metal Sourced From aConflict-Free Mine Site

It should also be understood that although the capacitor and the methodof forming thereof discussed above references a solid electrolyticcapacitor specifically, the present invention also contemplates anyother type of electrolytic capacitor that includes a valve metal, suchas a wet electrolytic capacitor. The wet electrolytic capacitorcontemplated by the present invention can include an anode formed froman anodically oxidized sintered porous pellet, a cathode, and a fluidicworking electrolyte. The pellet may be formed from a pressed valve metalpowder, and the pellet can be anodically oxidized so that a dielectriclayer is formed over and/or within the anode, as generally describedabove with respect to the solid electrolytic capacitor of the presentinvention. The wet electrolytic capacitor also includes a workingelectrolyte that is electrical communication with the anode and cathode.The electrolyte is a fluid that may be impregnated within the anode, orit may be added to the capacitor at a later stage of production. Thefluid electrolyte generally uniformly wets the dielectric on the anode.Various suitable electrolytes are described in U.S. Pat. Nos. 5,369,547and 6,594,140 to Evans, et al. Typically, the electrolyte is ionicallyconductive in that has an electrical conductivity of from about 0.1 toabout 20 Siemens per centimeter (“S/cm”), in some embodiments from about0.2 to about 15 S/cm, and in some embodiments, from about 0.5 to about10 S/cm, determined at a temperature of about 23° C. using any knownelectric conductivity meter (e.g., Oakton Con Series 11). The fluidelectrolyte is generally in the form of a liquid, such as a solution(e.g., aqueous or non-aqueous), colloidal suspension, gel, etc. Forexample, the electrolyte may be an aqueous solution of an acid (e.g.,sulfuric acid, phosphoric acid, or nitric acid), base (e.g., potassiumhydroxide), or salt (e.g., ammonium salt, such as a nitrate), as wellany other suitable electrolyte known in the art, such as a saltdissolved in an organic solvent (e.g., ammonium salt dissolved in aglycol-based solution). Various other electrolytes are described in U.S.Pat. Nos. 5,369,547 and 6,594,140 to Evans, et al.

Further, the cathode of the wet electrolytic capacitor typicallycontains a metal substrate, which may also optionally serve as a casingfor the capacitor. The substrate may be formed from a variety ofdifferent metals, such as tantalum, niobium, aluminum, nickel, hafnium,titanium, copper, silver, steel (e.g., stainless), alloys thereof,composites thereof (e.g., metal coated with electrically conductiveoxide), and so forth, where the source of the copper, for instance, canbe verified to be from a conflict-free mine site using the methodsdescribed herein. The geometric configuration of the substrate maygenerally vary as is well known to those skilled in the art, such as inthe form of a foil, sheet, screen, container, can, etc. The metalsubstrate may form the all or a portion of casing for the capacitor, orit may simply be applied to the casing. Regardless, the substrate mayhave a variety of shapes, such as generally cylindrical, D-shaped,rectangular, triangular, prismatic, etc. If desired, a surface of thesubstrate may be roughened to increase its surface area and increase thedegree to which a material may be able to adhere thereto. In oneembodiment, for example, a surface of the substrate is chemicallyetched, such as by applying a solution of a corrosive substance (e.g.,hydrochloric acid) to the surface. Mechanical roughening may also beemployed. For instance, a surface of the substrate may be abrasiveblasted by propelling a stream of abrasive media (e.g., sand) against atleast a portion of a surface thereof.

A conductive coating may also be disposed on a surface of the metalsubstrate (e.g., interior surface) to serve as an electrochemicallyactive material for the capacitor. Any number of layers may be employedin the coating. The materials employed in the coating may vary. Forexample, the conductive coating may contain a noble metal (e.g.,ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, gold,etc., where the source of the gold, for instance, can be verified to befrom a conflict-free mine site using the methods described herein), anoxide (e.g., ruthenium oxide), carbonaceous materials, conductivepolymers, etc. In one embodiment, for example, the coating may includeconductive polymer(s) that are typically π-conjugated and haveelectrical conductivity after oxidation or reduction. Examples of suchπ-conjugated conductive polymers include, for instance, polyheterocycles(e.g., polypyrroles, polythiophenes, polyanilines, etc.),polyacetylenes, poly-p-phenylenes, polyphenolates, and so forth.Substituted polythiophenes are particularly suitable for use asconductive polymer in that they have particularly good mechanicalrobustness and electrical performance.

As shown in FIG. 4, the anode 208 of the wet electrolytic capacitor 10may be positioned within a casing 12 made of a first casing member 14and a second casing member 15. The first casing member 14 can have aface wall 18 joined to a surrounding sidewall 20, which extends to anedge 22. The second casing member 15 may likewise contain a second facewall 24 having a surrounding edge 26. In the illustrated embodiment, thesecond casing member 15 is thus in the form of a plate that serves as alid for the casing 10. The casing members 14 and 15 may be hermeticallysealed together by welding (e.g., laser welding) the edges 22 and 26where they contact each other. In addition, gold brazing can be used tofacilitate the hermetical sealing of the casing members 14 and 15, wherethe source of the gold can be verified to be from a conflict-free minesite using the methods described herein. The casing members 14 and/or 15may be analogous to the metal substrate described above such that aconductive polymer coating (not shown) may be deposited on the interiorsurface thereof. Alternatively, a separate metal substrate may belocated adjacent to the casing member 14 and/or 16 and applied with theconductive polymer coating.

Although not shown, one or more separators may be employed between theanode and cathode (e.g., between the anode 208 and the first casingmember 14, between the anode 208 and the second casing member 15, orbetween the anode 208 and both casing members 14 and 15) that helpinsulate the anode 208 and conductive polymer-coated cathode from eachother. Examples of suitable materials for this purpose include, forinstance, porous polymer materials (e.g., polypropylene, polyethylene,etc.), porous inorganic materials (e.g., fiberglass mats, porous glasspaper, etc.), ion exchange resin materials, etc. Particular examplesinclude ionic perfluoronated sulfonic acid polymer membranes (e.g.,Nafion™ from the E.I. DuPont de Nemeours & Co.), sulphonatedfluorocarbon polymer membranes, polybenzimidazole (PBI) membranes, andpolyether ether ketone (PEEK) membranes. Although preventing directcontact between the anode and cathode, the separator permits ioniccurrent flow of the electrolyte to the electrodes.

A feedthrough may also be employed that electrically insulates the anodewire 220 from the casing 12. The feedthrough can extend from within thecasing 12 to the outside thereof, where a hole 34 may be provided in thesurrounding sidewall 20 of the casing member 14. The feedthrough may,for example, be a glass-to-metal seal (“GTMS”) that contains a ferrulewith an internal cylindrical bore of a constant inside diameter. Aninsulative glass can thus provide a hermetic seal between the bore andthe anode wire 220 passing therethrough.

After assembly and sealing (e.g., welding), the electrolyte mayoptionally be introduced into the casing through a fill-port. Fillingmay be accomplished by placing the capacitor in a vacuum chamber so thatthe fill-port extends into a reservoir of the electrolyte. When thechamber is evacuated, pressure is reduced inside the capacitor. When thevacuum is released, pressure inside the capacitor re-equilibrates, andthe electrolyte is drawn through the fill-port into the capacitor.

IV. Ceramic Capacitor Containing a Metal Component Sourced From aConflict-Free Mine Site

It should also be understood that although the capacitor and the methodof forming thereof discussed above references a solid electrolyticcapacitor or a wet electrolytic capacitor, the present invention alsocontemplates any other type of capacitor that includes a metalcomponent, such as a ceramic capacitor, which can include various layersand terminations formed from gold, cobalt, copper, tin, tungsten, or acombination thereof. As depicted in FIG. 5, a multilayer ceramiccapacitors is with multi-layered terminations. At least one layer insuch multi-layered terminations comprises a resistive material such thatadditional controlled ESR is provided to the respective capacitordevices. FIG. 5 depicts a multilayer ceramic capacitor 300 a. Theceramic capacitor 300 a includes a plurality of first conductive layerseach forming at least one first electrode element 302. A plurality ofsecond electrode elements 304 oppose selected of the first electrodeelements 302. Internal electrode elements 302 and 304 are arranged in astack within a body of dielectric material 306. Such stacked arrangementcan be alternatively set forth as an arrangement of first and secondconductive layers interleaved with a plurality of dielectric layers 306and pressed to form the device body of ceramic capacitor 300 a. Inaccordance with the capacitor embodiments disclosed in FIG. 5, first andsecond terminations comprise multiple layers, at least one of whichcorresponds to a resistive material. For example, multi-layeredterminations 312 and 314 each comprise an inner layer 308 adhered to thecapacitor body 300 a through any of the known termination methodologiesand an outer layer 310 plated thereon. In such an embodiment such innerlayer 308 may be an approximately 50-50 mix of ruthenium dioxide (RuO₂)and glass frit or any other suitable material. Alternatively, the innerlayer 308 may comprise an organic resistive material. Such an innerlayer 308 would provide a strong adhesive bond to the dielectric 306, aswell as outstanding thermal expansion characteristics. With suchmaterial, thermal shock problems (i.e., situations wherein continuedheating and cooling lead to separation of the terminations 312 and 314from the ceramic body 300 a) inherent in all capacitors may be reduced.The outer layer 310, plated to and fully enclosing the inner layer 308may comprise a metal such as tin, tungsten, cobalt, copper, gold, or thelike where the source of the such metals can be verified to be from aconflict-free mine site using the methods described herein.

Such a ceramic capacitor is capable of exhibiting low inductance and acontrolled equivalent series resistance (ESR) while maintaining a usefulcapacitance value at high operating frequencies. For instance, theimpedance, Z, of a typical capacitor decreases as it approaches itsresonant frequency, a point at which the impedance is equal to the ESRof the capacitor. The performance of certain embodiments of thedisclosed technology, while generally following the performance curve ofthe typical capacitor, differs in that its impedance at resonance (andthus its ESR) remains measurably higher than conventional multilayercapacitor performance. This increased ESR aids the device in minimizingits RF signal emissions and in matching the impedance of adjacentfunctional stages in an electronic device.

V. Other Electronic Parts Containing a Metal Component Sourced From aConflict-Free Mine Site

It should also be understood that although the sections above focus onthe formation of capacitors containing a metal component, the presentinvention is not limited to capacitors as the electronic part, and anyother electronic part containing gold, cobalt, copper, tin, tungsten, orlithium can also be made according to the methods described herein toensure that the electronic part contains one or more metals sourced froma conflict-free mine site. For instance, the electronic part can be amedical device, filter, inductor, active electrode, antenna, sensor,battery, etc., and the metal component can be a feedthrough, plating,conductive adhesive or paste, lead frame, termination, pin, wire,brazing, coil, etc.

These and other modifications and variations of the present inventionmay be practiced by those of ordinary skill in the art, withoutdeparting from the spirit and scope of the present invention. Inaddition, it should be understood that aspects of the variousembodiments may be interchanged both in whole or in part. Furthermore,those of ordinary skill in the art will appreciate that the foregoingdescription is by way of example only, and is not intended to limit theinvention so further described in such appended claims.

What is claimed is:
 1. A method of forming an electronic part comprisinga metal component, the method comprising: obtaining an unverifiedmineral sample from a mine site; analyzing the unverified mineral samplevia quantitative mineralogical analysis and comparing data collectedduring the quantitative mineralogical analysis for the unverifiedmineral sample to data in a database that corresponds to quantitativemineralogical analysis collected for verified mineral samples sourcedfrom one or more mine sites from a conflict-free geographic region todetermine if the unverified mineral sample is sourced from the one ormore mine sites from the conflict-free geographic region; and if it isdetermined that the unverified mineral sample is sourced from the one ormore mine sites from the conflict-free geographic region, converting theunverified mineral sample into the metal component.
 2. The method ofclaim 1, further comprising rejecting the unverified mineral sample ifit cannot be determined that the mineral sample is sourced from the oneor more mine sites from the conflict-free geographic region.
 3. Themethod of claim 1, wherein the conflict-free geographic region excludesthe Democratic Republic of Congo, Angola, Burundi, Central AfricanRepublic, Congo Republic, Rwanda, Sudan, Tanzania, Uganda, and Zambia.4. The method of claim 1, wherein analyzing the unverified mineralsample via quantitative mineralogical analysis comprises polishing theunverified mineral sample to expose grain interiors present in theunverified mineral sample.
 5. The method of claim 4, further comprisingperforming automated mineralogy testing on the unverified mineralsample.
 6. The method of claim 5, further comprising identifying grainsfor additional testing based on data obtained during automatedmineralogy testing.
 7. The method of claim 6, further comprisingperforming electron micro probe analysis (EMPA) on the identifiedgrains.
 8. The method of claim 7, further comprising performing laserablation inductively coupled plasma spectrometry (LA-ICP-MS) on theidentified grains.
 9. The method of claim 8, wherein it is determinedthat the unverified mineral sample is sourced from the one or more minesites from the conflict-free geographic region if data collected duringthe automated mineralogy testing, EMPA, and LA-ICP-MS for the unverifiedmineral sample substantially matches data collected during the automatedmineralogy testing, EMPA, and LA-ICP-MS for one of the verified mineralsamples sourced from the one or more mine sites from the conflict-freegeographic region.
 10. The method of claim 1, wherein the unverifiedmineral sample comprises a metal, wherein the metal comprises gold,cobalt, copper, tin, tungsten, lithium, or a combination thereof. 11.The method of claim 10, wherein converting the unverified mineral sampleinto the metal component comprises: separating the metal from theunverified mineral sample; forming the metal into the metal component.12. The method of claim 1, wherein the electronic part is a capacitor.13. The method of claim 12, wherein the capacitor is a ceramiccapacitor, a solid electrolytic capacitor, or a wet electrolyticcapacitor.
 14. The method of claim 1, the electronic part is a medicaldevice, a filter, an inductor, an active electrode, an antenna, asensor, or a battery.
 15. The method of claim 1, wherein the metalcomponent is a feedthrough, a plating, a conductive adhesive or paste, alead frame, a termination, a pin, a wire, a brazing, or a coil.
 16. Anelectronic part comprising a metal component, wherein the metalcomponent includes a metal, wherein it is verified that the metal issourced from one or more mine sites from a conflict-free geographicregion by analyzing an unverified mineral sample from which the metal isobtained via quantitative mineralogical analysis and comparing datacollected during the quantitative mineralogical analysis for theunverified mineral sample to data in a database that corresponds toquantitative mineralogical analysis collected for verified mineralsamples sourced from the one or more mine sites from the conflict-freegeographic region to determine that the unverified mineral sample issourced from the one or more mine sites from the conflict-freegeographic region.
 17. The electronic part of claim 16, wherein themetal comprises gold, cobalt, copper, tin, tungsten, lithium, or acombination thereof.
 18. The electronic part of claim 16, wherein theelectronic part is a capacitor.
 19. The electronic part of claim 18,wherein the capacitor is a ceramic capacitor, a solid electrolyticcapacitor, or a wet electrolytic capacitor.
 20. The electronic part ofclaim 16, wherein the electronic part is a medical device, a filter, aninductor, an active electrode, an antenna, a sensor, or a battery. 21.The electronic part of claim 16, wherein the metal component is afeedthrough, a plating, a conductive adhesive or paste, a lead frame, atermination, a pin, a wire, a brazing, or a coil.